page . 1 stad-jan.27.2004 maximum ratings and electrical characteristics .049(1.25) .047(1.2)dia. .043(1.1) .008(0.2) .008(0.2) .071(1.8) .079(2.0) micro-melf unit:inch(mm) data sheet gmz2.0~gmz56 surface mount zener diodes voltage 2.0 to 56 volts power 500 mwatts r e t e m a r a pl o b m y se u l a vs t i n u 5 2 = b m a t t a n o i t a p i s s i d r e w o p o c p tot 0 0 5w m e r u t a r e p m e t n o i t c n u j t j 5 7 1 o c e g n a r e r u t a r e p m e t e g a r o t s t s 5 7 1 + o t 5 6 - o c . e r u t a r e p m e t t n e i b m a t a t p e k e r a e s a c m o r f m m 0 1 f o e c n a t s i d a t a s d a e l t a h t d e d i v o r p d i l a v r e t e m a r a pl o b m y s. n i m. p y t . x a ms t i n u r i a t n e i b m a o t n o i t c n u j e c n a t s i s e r l a m r e h t rh ta - - - - 3 . 0w m / k a m 0 0 1 = f i t a e g a t l o v d r a w r o f vf - - - - 1v . e r u t a r e p m e t t n e i b m a t a t p e k e r a e s a c m o r f m m 0 1 f o e c n a t s i d a t a s d a e l t a h t d e d i v o r p d i l a v features ? planar die construction ? 500mw power dissipation ? ideally suited for automated assembly processes mechanical data ? case: molded glass micro-meif ? terminals: solderable per mil-std-750, method 2026 ? polarity: see diagram below ? approx. weight: 0.01 grams ? mounting position: any ? packing information t/r - 2.5k per 7" plastic reel in compliance with eu rohs 2002/95/ec directives
page . 2 stad-jan.27.2004 r e b m u n t r a p s s a l c v z @i zt z i (m ) a r v ) v ( ) a u ( r i x a m t z i ) a m ( z zt ( ? ?
page . 3 stad-jan.27.2004 r e b m u n t r a p s s a l c v z @i zt z i (m ) a r v ) v ( ) a u ( r i x a m t z i ) a m ( z zt ( ? ?
page . 4 stad-jan.27.2004 vz (v) 2.7 3.9 4.3 4.7 5.1 5.6 6.2 6.8 9.1 11 12 15 20 24 5 10 15 20 25 0 iz (ma) 10 20 30 40 50 30 fig. 1 power derating curve 50 0 100 200 300 400 500 100 150 200 250 ambient temperature, c o power dissipation, mwatts fig.2 breakdown characteristics test current iz=20ma rating and characteristic curves
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